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Samsung Develops 32GB Green DDR3 Using TSV Package Technology

Samsung Electronics has developed 32 GB Green DDR3 for next generation servers using TSV package technology for the first time in the industry. It boasts the maximum transmission speeds of 1.333 MB/s, a 67% increase from the current mo[...]
Samsung Develops 32GB Green DDR3 Using TSV Package Technology
Samsung Develops 32GB Green DDR3 Using TSV Package Technology

Via Samsung

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The future of DRAM by Samsung

Samsung Electronics is working on a new technology to optimise the DRAM and reduce its power consumption at the same time. Known as “Through Silicon Via” (TSV) this new system should “soon result in memory packages th[...]
The future of DRAM by Samsung

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