Samsung Develops 32GB Green DDR3 Using TSV Package Technology
By Daimaou - G.G-B - [18/8/2011 - 08:00] - 
1 - Peripherals
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Samsung Electronics has developed 32 GB Green DDR3 for next generation servers using TSV package technology for the first time in the industry. It boasts the maximum transmission speeds of 1.333 MB/s, a 67% increase from the current mo[...]
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Via Samsung
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The future of DRAM by Samsung
By Daimaou - G.G-B - [23/4/2007 - 10:01] - 0 - Pc
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Samsung Electronics is working on a new technology to optimise the DRAM and reduce its power consumption at the same time. Known as “Through Silicon Via” (TSV) this new system should “soon result in memory packages th[...]
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erikku - [20/05/2013 - 01:24]