Samsung’new high performance memory module
By Akihabara News Team - [7/12/2010 - 04:42] - 
0 - Science
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TSV stands for “through silicon via” and is the name of the new three-dimensional chip stacking technology behind Samsung’s latest Green DDR3 DRAM module. According to Samsung, TSV will enable users to save up to 40% [...]
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Via Samsung
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IntensaFire controller mod is now for PS3 with piece of cake installation
By Akihabara News Team - [17/5/2010 - 05:36] - 0 - Gaming Peripherals
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In case you have not heard about the IntensaFire controller mod before from last year when it was released for Xbox 360: It is offered by the company BGR Mods and basically boosts the firing speed of the controller of your gaming conso[...]
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Via BGR Mods
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Samsung Ships Industry’s First Multi-chip Package with a PRAM Chip for Handsets
By Daimaou - G.G-B - [29/4/2010 - 03:42] - 0 - Peripherals
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Samsung today announced the industry’s first multi-chip package (MCP) with PRAM – for use in mobile handsets, beginning later this quarter. The 512 megabit Samsung PRAM in the MCP is backward compatible with 40 nanometer-class* NOR fla[...]
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Via Samsung
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Samsung producing 30nm 3-bit, DDR flash memory (MLC NAND)
By Daimaou - G.G-B - [1/12/2009 - 03:23] - 0 - Misc
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Samsung said this morning that it has started mass production of 2 different kinds of 30nm (Nanometer) Multi-Lever Cell NAND memory, 3 times faster than actual NAND chips offering at peak a 133Mbps speed instead of the actual 40Mbps. S[...]
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Via Samsung
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Samsung Develops World’s First 65nm Digital TV Receiver Chip
By Daimaou - G.G-B - [12/12/2007 - 11:47] - 0 - Image
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Samsung Electronics Co., Ltd., a leader in advanced semiconductor technology, announced today the development of a new digital TV receiver chip (S5H1432) using 65nm process technology for terrestrial digital video broadcasting (DVB-T),[...]
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erikku - [20/05/2013 - 01:24]