Samsung’new high performance memory module
|
TSV stands for “through silicon via” and is the name of the new three-dimensional chip stacking technology behind Samsung’s latest Green DDR3 DRAM module. According to Samsung, TSV will enable users to save up to 40% [...]
|
|
|
|
|
|
Via Samsung |
|
Toshiba in Paris: the Satellite X200-20
|
The new Satellite X200-20 laptop is presented by Toshiba as the perfect gamer machine. It features a 17 inches monitor (1440×900) and a 256(512)MB Geforce 8700 MGT, DX10, a 200GB HDD or 2 160GB, an Harman Kardon audio system…[...]
|
|
|
|
|
|
|
|












Business Etiquette Training - [29/05/2012 - 13:55]