By >Akihabara News Team
Fujitsu’s new ultra compact, high speed WLAN module
Fujitsu started last week a new USB 2.0 wireless module, the MBH7WLZ21, that has 802.11 b/g/n compatibility. The module is based on the Ralink RT3070 chip, measures 14.7 x 18.8 x 2.1mm and is designed to fit ultra compact devices, with or without antenna. It is also available as a dongle (MBH7WLZ22) that measures 17.5 x 59.0 x 4.8mm.
Fujitsu’s new MBH7WLZ21 module is based on the Ralink RT3070 chip. It supports USB and antenna diversity to fully utilize the 802.11n protocol’s PHY rate of up to 150Mbps (20/40MHz bandwidth) for both transmit/receive modes (1×1).
The surface-mount module has a 14.7 x 18.8 x 2.1mm footprint designed for integration into ultra-compact, low-profile devices requiring high-speed graphic/audio communication for consumer, industrial and healthcare markets. It is also available as a dongle (MBH7WLZ22) with a USB header and built-in antenna that measures 17.5 x 59.0 x 4.8mm.
Software support includes embedded 64/128-bit WEP, WPA, and WPA2 enhanced security for enciphering/deciphering wireless data. The module also supports Quality of Service (Wi-Fi Multimedia (WMM) and WMM-Power Save functionality).
Fujitsu brings innovation from many years of industry-leading Multi-Chip Module design and production experience, resulting in smaller wireless module package sizes that consume less power than competing products.