Published on December 7th,2010 at 5:35 PM
By >Akihabara News Team

Fujitsu’s new ultra compact, high speed WLAN module

Fujitsu started last week a new USB 2.0 wireless module, the MBH7WLZ21, that has 802.11 b/g/n compatibility. The module is based on the Ralink RT3070 chip, measures 14.7 x 18.8 x 2.1mm and is designed to fit ultra compact devices, with or without antenna. It is also available as a dongle (MBH7WLZ22) that measures 17.5 x 59.0 x 4.8mm.

Sunnyvale, CA, November 30, 2010 — Fujitsu Components America, Inc. today introduced a wireless module with USB 2.0 interface that provides full-featured 802.11 b/g/n Wireless Local Area Network (WLAN) capabilities in a very small form factor.

Fujitsu’s new MBH7WLZ21 module is based on the Ralink RT3070 chip. It supports USB and antenna diversity to fully utilize the 802.11n protocol’s PHY rate of up to 150Mbps (20/40MHz bandwidth) for both transmit/receive modes (1×1).

The surface-mount module has a 14.7 x 18.8 x 2.1mm footprint designed for integration into ultra-compact, low-profile devices requiring high-speed graphic/audio communication for consumer, industrial and healthcare markets. It is also available as a dongle (MBH7WLZ22) with a USB header and built-in antenna that measures 17.5 x 59.0 x 4.8mm.

Software support includes embedded 64/128-bit WEP, WPA, and WPA2 enhanced security for enciphering/deciphering wireless data. The module also supports Quality of Service (Wi-Fi Multimedia (WMM) and WMM-Power Save functionality).

Fujitsu brings innovation from many years of industry-leading Multi-Chip Module design and production experience, resulting in smaller wireless module package sizes that consume less power than competing products.

Category Wireless
              
Fujitsu’s new ultra compact, high speed WLAN module
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