VIA Technologies, Inc. announced their latest innovation the Mobile-ITX which boasts to be the smallest x86 CPU-on-module specification currently in the industry. Measuring only 6cm x 6cm, it is even 50% smaller than Via’s Pico-ITX form factor. What’s more, as it comes with a “modularized design that includes a CPU module card and an I/O carrier board” it provides flexibility for developers of next generation ultra-compact embedded devices. And CPU modules based on the Mobile-ITX form factor integrate core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customizable baseboards.

About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators.