By >Daimaou - G.G-B
Samsung Develops 32GB Green DDR3 Using TSV Package Technology
Samsung Electronics has developed 32 GB Green DDR3 for next generation servers using TSV package technology for the first time in the industry. It boasts the maximum transmission speeds of 1.333 MB/s, a 67% increase from the current models for server, and also provides about 30% additional energy savings, which is realized by to the adoption of TSV technology. An executive at the company said that “These 32GB RDIMMs fully support the high-density and high-performance requirements of next-generation high-capacity servers,” adding that “We will keep providing memory solutions with higher performance and density, while enhancing shared value in the design of ever-greener server systems”.
Samsung’s advanced 30 nanometer (nm) class* technology leverages module performance and power features to deliver a substantially greener memory solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation.
“These 32GB RDIMMs fully support the high-density and high-performance requirements of next-generation high-capacity servers,” said Wanhoon Hong, executive vice president, memory sales & marketing, Device Solutions, Samsung Electronics. “We will keep providing memory solutions with higher performance and density, while enhancing shared value in the design of ever-greener server systems,” he added.
The new 32GB RDIMM with 3D TSV package technology is based on Samsung’s 30nm-class four gigabit (Gb) DDR3. It can transmit at speeds of up to 1,333 megabits per second (Mbps), a 70 percent gain over preceding quad-rank 32GB RDIMMs with operational speeds of 800Mbps.
Further, the 32GB-module consumes a mere 4.5 watts per hour – the lowest power consumption level among memory modules adopted for use in enterprise servers. Compared to the 30nm-class 32GB load-reduced, dual-inline memory module (LRDIMM), which offers advantages in constructing 32GB or higher memory solutions, the new 32GB module provides approximately 30 percent additional energy savings.
These savings are directly attributable to the adoption of TSV technology, which enables a multi-stacked chip to function at levels comparable to a single silicon chip by shortening signal lines significantly, thereby lowering power consumption and achieving higher density and operational speed.
Samsung has collaborated with CPU and controller designers in addition to some current server system customers to facilitate quicker adoption of 3D-TSV server modules, and to pave the way for more easily supporting 32GB and higher-density memory modules based on 20nm-class DDR3 for use in high-capacity servers.